Semiconductor device and fabrication method thereof

ABSTRACT

A semiconductor device includes a gate electrode formed on a silicon substrate via a gate insulation film in correspondence to a channel region, source and drain regions of a p-type diffusion region formed in the silicon substrate at respective outer sides of sidewall insulation films of the gate electrode, and a pair of SiGe mixed crystal regions formed in the silicon substrate at respective outer sides of the sidewall insulation films in epitaxial relationship to the silicon substrate, the SiGe mixed crystal regions being defined by respective sidewall surfaces facing with each other, wherein, in each of the SiGe mixed crystal regions, the sidewall surface is defined by a plurality of facets forming respective, mutually different angles with respect to a principal surface of the silicon substrate.

CROSS-REFERENCE TO RELATED APPLICATION

The present application is a Divisional of application Ser. No.11/107,945 filed Apr. 18, 2005 which is based on Japanese priorityapplication No. 2004-380619 filed on Dec. 28, 2004, the entire contentsof which are hereby incorporated by reference.

BACKGROUND OF THE INVENTION

The present invention generally relates to semiconductor devices andmore particularly to a semiconductor device having improved operationalspeed as a result of stressing and the fabrication process thereof.

With progress in the art of device miniaturization, it is now possibleto fabricate ultrafine and ultra high-speed semiconductor devices havinga gate length of 100 nm or less.

In such ultrafine and ultra high-speed transistors, the area of thechannel region right underneath the gate electrode is reduced ascompared with conventional semiconductor devices, and the mobility ofelectrons or holes traveling through the channel region is influencedheavily by the stress applied to such a channel region.

Thus, there are various attempts made for improving the operationalspeed of the semiconductor device by optimizing the stress applied tosuch a channel region.

In semiconductor devices that use a silicon substrate as a channelregion, the mobility of holes is generally smaller than the mobility ofelectrons, and thus, it is particularly important to improve theoperational speed of p-channel MOS transistors, in which holes are usedfor the carriers, in the designing of semiconductor integrated circuits.

With such p-channel MOS transistors, it is known that the mobility ofcarriers is improved by applying a uniaxial compressive stress to thechannel region, and there is a proposal to use the construction of FIG.1 as the means of applying the compressive stress to the channel region.

Referring to FIG. 1, there is formed a gate electrode 3 on a siliconsubstrate 1 via a gate insulation film 2, and p-type diffusion regions 1a and 1 b are formed in the silicon substrate 1 at both lateral sides ofthe gate electrode 3 so as to define the channel region. Further,sidewall insulation films 3A and 3B are formed on the sidewall surfacesof the gate electrode 3 so as to cover also a surface part of thesilicon substrate 1.

Thereby, the diffusion regions 1 a and 1 b function respectively as asource extension region and a drain extension region of the MOStransistor, and the flow of the holes transported through the channelregion right underneath the gate electrode 3 from the diffusion region 1a to the diffusion region 1 b is controlled by the gate voltage appliedto the gate electrode 3.

Further, there are formed SiGe mixed crystal regions 1A and 1B in thesilicon substrate 1 in the construction of FIG. 1 at respective outersides of the sidewall insulation films 3A and 3B with epitaxialrelationship with the silicon substrate 1, and p-type source and drainregions are formed in the SiGe mixed crystal regions 1A and 1Brespectively in continuation from the diffusion region 1 a and thediffusion region 1 b.

Because the SiGe mixed crystal regions 1A and 1B have a larger latticeconstant larger than that of the silicon substrate 1 in the MOStransistor of the construction of FIG. 1, the SiGe mixed crystal regions1A and 1B are applied with a compressive stress shown in FIG. 1 by anarrow a, and as a result, the SiGe mixed crystal regions 1A and 1Bundergo deformation in the direction generally perpendicular to thesurface of the silicon substrate 1 as shown by an arrow b.

Because the SiGe mixed crystal regions 1A and 1B are thus formedepitaxially on the silicon substrate 1, such a deformation of the SiGemixed crystal regions 1A and 1B represented by the arrow b induces acorresponding deformation in the channel region of the silicon substrateas represented by an arrow c, while such a deformation in the channelregion induces a uniaxial compressive stress in the channel region asrepresented by an arrow d.

As a result of such a uniaxial compressive stress applied to the channelregion of the MOS transistor of FIG. 1, the symmetry of the Si crystalconstituting the channel region is locally modulated, and as a result ofsuch local modulation of the symmetry, degeneration of heavy holes andlight holes in the valence band is resolved. Thereby, there is causedincrease of hole mobility in the channel region, leading to improvementof operational speed of the transistor.

It should be noted that such increase of hole mobility caused in thechannel region by locally induced stress appears particularlyconspicuously in the ultrafine semiconductor devices having a gatelength of 100 nm or less.

References

-   (Patent Reference 1) U.S. Pat. No. 6,621,131-   (Patent Reference 2) Japanese Laid-Open Patent Application    2004-31753-   (Non-Patent Reference 1) Thompson, S. E., et al., IEEE Transactions    on Electron Devices, vol. 51, No. 11, November, 2004, pp. 1790-1797

SUMMARY OF THE INVENTION

FIG. 2 shows the construction of a p-channel MOS transistor based onsuch a principle and described in Non-Patent Reference 1. In thedrawing, those parts corresponding to the parts described previously aredesignated by the same reference numerals and the description thereofwill be omitted.

Referring to FIG. 2, the SiGe mixed crystal regions 1A and 1B are formedepitaxially so as to fill the respective trenches formed in the siliconsubstrate 1 up to the level higher than the interface between thesilicon substrate 1 and the gate electrode 2 represented in the drawingby a dotted line L,

Further, it should be noted that the mutually facing side surfaces 1Asand 1Bs of the SiGe mixed crystal regions 1A and 1B are formed to have acurved shape such that the distance between the SiGe mixed crystalregions 1A and 1B increases continuously in the downward direction ofthe silicon substrate 1 from the lower surface of the gate insulationfilm 2.

Further, in the conventional construction of FIG. 2 in which the SiGemixed crystal regions 1A and 1B grown to the level higher than theforegoing level L are formed directly with a silicide layer 4. A similarsilicide layer 4 is formed also on the polysilicon gate electrode 3.

Further, in Non-Patent Reference 1 corresponding to the MOS transistorof FIG. 2, the use of a SiGe mixed crystal having the composition ofSi_(0.83)Ge_(0.17) is disclosed for the SiGe mixed crystal regions 1Aand 1B. Further, the foregoing Non-Patent Reference 1 discloses the Geconcentration of 15 atomic percent for the SiGe mixed crystal regions 1Aand 1B. Thereby, it is disclosed that epitaxy will be lost when the Geconcentration exceeds the foregoing concentration of 20 atomic percent.

On the other hand, it is thought that the operational speed of thep-channel MOS transistor would be increased further when the uniaxialcompressive stress in the channel region is increased further in such aconventional p-channel MOS transistor.

Further, it is noted that, in the conventional art of Patent Reference1, the epitaxial regrowth process the SiGe mixed crystal regions 1A and1B is conducted at the temperature of 740° C., while the use of thetemperature exceeding 650° C. would cause unwanted re-distribution ofthe impurity elements in the diffusion regions 1 a and 1 b or 1 c and 1d, and it becomes difficult to achieve the desired operationalcharacteristics of the p-channel MOS transistor.

Further, it is noted that the conventional p-channel MOS transistor ofFIG. 2 forms the silicide film 4 directly on the epitaxially grown SiGemixed crystal regions 1A and 1B, while a nickel silicide film, which isthought as being an outstanding candidate silicide for the generation of90 nm node or later, accumulates therein a tensile stress. Thus, withsuch direct formation of silicide layer on the SiGe mixed crystalregions 1A and 1B as in the construction of FIG. 2, the stress appliedto the channel region of the p-channel MOS transistor for enhancing thehole mobility is inevitably cancelled out at least partially.

Further, such formation of silicide layer on the SiGe mixed crystallayer causes various problems such as degradation of heat resistance ormorphology of the silicide with increasing Ge concentration in the SiGemixed crystal layer, and it becomes difficult to form such a silicidelayer on the SiGe mixed crystal layers with ordinary salicide process inthe case the SiGe mixed crystal contains high concentration Ge forincreasing the stress as in the case of the p-channel MOS transistor ofFIG. 2.

In a first aspect, the present invention provides a semiconductordevice, comprising:

a silicon substrate including a channel region;

a gate electrode formed on said silicon substrate in correspondence tosaid channel region via a gate insulation film, said gate electrodecarrying respective sidewall insulation films on a pair of mutuallyopposing sidewall surfaces thereof;

source and drain extension regions formed in said silicon substrate atrespective lateral sides of said gate electrode across said channelregion in the form of a p-type diffusion region;

source and drain regions formed in said silicon substrate at respectiveouter sides of said sidewall insulation films in the form of a p-typediffusion region respectively as a continuation of said source extensionregion and a continuation of said drain extension region; and

a pair of SiGe mixed crystal regions formed in said silicon substrate atrespective outer sides of said sidewall insulation films so as to beincluded in said source region and said drain region, respectively, saidpair of SiGe mixed crystal regions having an epitaxial relationship withsaid silicon substrate,

each of said SiGe mixed crystal regions being grown to a level higherthan an interface between said gate insulation film and said siliconsubstrate,

each of said SiGe mixed crystal regions having a sidewall surface facingto another SiGe mixed crystal region such that said sidewall surface isdefined by a plurality of facets forming respective, different angleswith respect to a principal surface of said silicon substrate.

In another aspect, the present invention provides a method offabricating a semiconductor device having a pair of SiGe compressivestressors at respective lateral sides of a channel region, comprisingthe steps of:

forming a gate electrode on said silicon substrate in correspondence tosaid channel region via a gate insulation film;

forming a pair of p-type diffusion regions in said silicon substrate incorrespondence to respective lateral sides of said gate electrodes;

forming a pair of p-type diffusion regions in said silicon substrate incorrespondence to respective lateral sides of said gate electrode with aseparation from said channel region by a distance corresponding to athickness of respective gate sidewall insulation films on said gateelectrode as source and drain regions;

forming a pair of trenches in said silicon substrate respectively incorrespondence to source and drain regions by conducting an etchingprocess, such that each of said trenches has a sidewall surface definedby a plurality of facets and such that, in each of said trenches, saidsidewall surface and a bottom surface are covered continuously by saidp-type diffusion region constituting said source or said drain region;and

filling said trenches by an epitaxial growth of a p-type SiGe layer,

said epitaxial growth of said p-type SiGe layer is conducted at atemperature of 400-550° C.

In another aspect, the present invention provides a method offabricating a semiconductor device having a pair of SiGe compressivestressors at both lateral ends of a channel region, comprising the stepsof:

forming a gate electrode on a silicon substrate in correspondence tosaid channel region via a gate insulation film;

forming a pair of p-type diffusion regions in said silicon substrate incorrespondence to both lateral sides of said gate electrode;

forming a pair of trenches in said silicon substrate respectively incorrespondence to lateral sides of said gate electrode with a separationfrom said channel region corresponding to a gate sidewall insulationfilm formed on said gate electrode, such that each of said trenches hasa sidewall surface defined by a plurality to f facets;

covering, in each of said pair of trenches, said sidewall surface and abottom surface of said trench by a Si epitaxial layer doped to p-type;and

filling, in each of said trenches, said trench by growing a p-type SiGemixed crystal layer epitaxially on said Si epitaxial layer,

said step of growing said p-type SiGe layer epitaxially being conductedat a temperature of 400-550° C.

According to the present invention, a uniaxial compressive stress isapplied to the channel region by growing a p-type SiGe mixed crystallayer at both lateral sides of said channel region epitaxially, and themobility of holes transported through the channel region is improvedsignificantly.

Thereby, the present invention achieves optimization of the uniaxialstress applied to the channel region by forming the foregoing pair ofp-type SiGe mixed crystal regions such that respective, mutually facingsidewall surfaces are formed of plurality of facets forming respective,different angles with respect to a principal surface of said siliconsubstrate, and the operational speed of the semiconductor device isimproved further as compared with the conventional construction in whichthe foregoing sidewall surfaces of the SiGe mixed crystal regions aredefined by a continuous, curved surface and thus the distance betweenthe SiGe mixed crystal regions across the channel region increasesrapidly with increasing distance in the downward direction of thesilicon substrate from the interface between the gate insulation filmand the silicon substrate.

Particularly, by forming the sidewall surfaces of the SiGe mixed crystalregions to have a wedge shape such that the respective SiGe mixedcrystal regions invade to the region right underneath the gate sidewallinsulation films from both lateral sides of the channel region, itbecomes possible with the present invention to maximize the uniaxialcompressive stress applied to the silicon substrate in such a channelregion, including the effect of stress concentration at the wedge tipend part.

Further, because each of the p-type SiGe mixed crystal regions areformed on a limited area of the silicon substrate, it has beendiscovered that it is possible to increase the Ge concentration in thep-type SiGe mixed crystal regions beyond the limiting concentrationcorresponding to the critical thickness up to the concentration of 40%in terms of atomic percent, contrary to the case of forming acontinuous, two-dimensional film. Thereby, the effect of improvement ofthe semiconductor device caused by the compressive stress can bemaximized.

In the present invention, on the other hand, it is preferable tosuppress the Ge atomic concentration such that the Ge atomicconcentration does not exceed 28% in view of avoiding the problem ofdegradation of crystal quality of the foregoing p-type SiGe mixedcrystal regions, which starts, according to the discovery of theinventor of the present invention, when the Ge atomic concentration hasexceeded the value of 28%.

Further, according to the present invention, it becomes possible toreduce the adversary effect of the tensile stress caused by the silicidelayers formed on the source/drain regions of the semiconductor device,by growing the p-type SiGe mixed crystal regions beyond the level of theinterface between the gate insulation film of the semiconductor deviceand the silicon substrate. It should be noted that such a tensile stresscancels out the effect of the uniaxial compressive stress induced in thechannel region.

Particularly, by growing a p-type Si layer or a p-type SiGe layer ofsmall Ge concentration on the foregoing p-type SiGe mixed crystalregions epitaxially, it becomes possible to avoid the problemsassociated with the difficulty of forming a silicide layer on a SiGemixed crystal layer of high Ge concentration.

It should be noted that the increase of hole mobility caused byapplication of compressive stress to the channel region of the p-channelMOS transistor appears most conspicuously when the silicon substrate isa so-called (001) substrate and the gate electrode is formed on thesilicon substrate in the <110> direction.

Further, according to the present invention, in which the trench isformed at both lateral sides of the gate electrode after forming thep-type diffusion regions and such trenches are filled with the p-typeSiGe mixed crystal layer by a low temperature process that uses thedeposition temperature of 400-550° C., the impurity distribution profileof the diffusion regions formed already is not modified, and it becomespossible to construct the semiconductor device with the desiredcharacteristics. Further, as a result of such a low temperature growth,it becomes possible to introduce Ge into the p-type SiGe mixed crystallayer with the concentration reaching 40% in terms of atomic percent.

Further, according to the present invention, it becomes possible to forma silicide layer in electrical connection with the source/drain regionsof the semiconductor device by forming a Si epitaxial cap layersubstantially free from Ge or having a Ge concentration of 20% or less,on the SiGe mixed crystal layer grown by the low temperature epitaxialprocess. Further, with such a construction in which the silicide layeris formed on the cap layer at the level far above the interface betweenthe gate insulation film and the silicon substrate, the problem ofcancellation of the uniaxial compressive stress caused in the channelregion by the tensile stress caused by the silicide layer is reduced.

Further, with the formation of such a cap layer of relatively low Geconcentration, it becomes possible to suppress the degradation of heatresistance of the silicide layer or degradation of surface morphology ofthe silicide layer, which occur when the Ge concentration is increased,and stable and reliable formation of silicide becomes possible.

With the present invention, it is also possible to form the trenches inthe silicon substrate at first. In this case, the SiGe mixed crystallayer is grown after growing the p-type Si epitaxial layer on thesurface of the trenches. According to such a process, too, the problemof modification of the impurity distribution profile in the sourceextension region and drain extension region formed by injecting theimpurity elements while using the gate electrode is effectively avoided.

Meanwhile, in such ultrafine and ultra fast semiconductor devices thatapply the compressive stress to the channel region by the SiGe mixedcrystal stressors, it is generally practiced to conduct a native oxideremoval process in the channel region after formation of the deviceisolation regions but before formation of the gate insulation film.Thereby, it is known that, as a result of thermal annealing processconducted in high-temperature hydrogen ambient for removal of such anative oxide film, the Si atoms migrate freely over the exposed siliconsubstrate surface, and as a result, there appears a curved, convexsurface on the silicon substrate forming the device region. Thus, whenan etching process is applied to such a convex silicon surface forforming the foregoing trenches, there appears a corresponding convexsurface morphology at the bottom to the trenches. Thereby, because theSiGe mixed crystal regions grown epitaxially on such trenches form aflat facet as a result of a self-limiting process occurring in such acrystal growth process, the volume of the SiGe mixed crystal regionsconstituting the compressive stressors is reduced by the volume of theforegoing convex surface. With this, the compressive stress caused bythe SiGe mixed crystal layer is reduced unwantedly.

Contrary to the foregoing, the present invention successfully avoidssuch decrease of the compressive stress, by limiting the temperature ofthe thermal annealing process conducted before formation of the gateinsulation film for removal of the gate insulation film to be 900° C. orless and further by conducting the foregoing thermal annealing processin an inert ambient free from hydrogen.

Other objects and further features of the present invention will becomeapparent from the following detailed description when read inconjunction with the attached drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a diagram showing the principle of the semiconductor devicethat uses the SiGe mixed crystal layer as a compressive stressor;

FIG. 2 is a diagram showing the construction of a conventionalsemiconductor device that uses a SiGe mixed crystal layer as thecompressive stressor;

FIG. 3 is a diagram showing the construction of a semiconductor deviceaccording to a first embodiment of the present invention;

FIGS. 4A-4F are diagrams showing various modifications of thesemiconductor device of FIG. 3;

FIGS. 5A-5D are diagrams showing a trench formation process of varioussemiconductor devices according to the first embodiment of the presentinvention;

FIG. 6 is a diagram defining various parameters of the semiconductordevice according to the first embodiment of the present invention;

FIG. 7 is a diagram showing the fabrication process of the semiconductordevice according to a modification of the present invention;

FIGS. 8A-8E are diagrams showing the fabrication process of thesemiconductor device of FIG. 4D according to a second embodiment of thepresent invention;

FIG. 9 is a diagram defining the parameters of the semiconductor deviceof FIG. 4D;

FIGS. 10A-10C are diagrams respectively showing various fabricationmethods of the semiconductor devices according to a third embodiment ofthe present invention;

FIG. 11 is a diagram showing the growth method of a SiGe mixed crystallayer conducted by using a cluster-type substrate processing apparatusaccording to a fourth embodiment of the present invention;

FIGS. 12A-12C are diagrams explaining the object of the presentinvention related to a fifth embodiment of the present invention;

FIGS. 13A-13C are diagrams explaining the fifth embodiment of thepresent invention; and

FIGS. 14A-14C are diagrams explaining a sixth embodiment of the presentinvention.

DETAILED DESCRIPTION OF THE INVENTION First Embodiment

FIG. 3 shows the construction of a p-channel MOS transistor 10 accordingto a first embodiment of the present invention.

Referring to FIG. 3, the p-channel MOS transistor 10 is formed on ann-type device region 11A defined on a silicon substrates of a (001)surface orientation by a STI device isolation region 11I, wherein a highquality gate insulation film 12 of a thermal oxide film or an SiON filmis formed on the silicon substrate 11 in correspondence to a channelregion in the device region 11A with a thickness of about 1.2 nm.

On the gate insulation film 11, there is formed a polysilicon gateelectrode 12 doped to a p-type, wherein the silicon substrate surfaceexposed at both lateral sides of the gate electrode 13 is covered withCVD oxide films 12I in the aforementioned device region 11A. Thereby, itshould be noted that each CVD oxide film 12I extends continuously andcovers the sidewall surface of the gate electrode 13. Further, sidewallinsulation films 13A and 13B are formed on the respective sidewallsurfaces of the gate electrode 13 via the respective thermal oxide films12I.

Further, trenches 11TA and 11TB are formed in the silicon substrate 11at respective outer sides of the sidewall insulation films 13A and 13B,wherein the foregoing trenches 11TA and 11TB are filled with respectivep-type SiGe mixed crystal regions 14A and 14B, which are grownepitaxially on the silicon substrate 11 at the foregoing trenches 11TAand 11TB.

Because the SiGe regions 14A and 14B thus grown epitaxially to thesilicon substrate 11 have a larger lattice constant as compared with theSi crystal that constitutes the silicon substrate 11, the SiGe regions14A and 14B induces a uniaxial compressive stress in the channel regionformed in the silicon substrate 11 right underneath the gate electrode13 by the mechanism explained previously with reference to FIG. 1.

Furthermore, with the p-channel MOS transistor 10 of FIG. 3, there areformed n-type pocket injection regions 11 p in the silicon substrate 11in correspondence to the device region 11A by injecting an n-typeimpurity element such as Sb obliquely to the regions of the siliconsubstrate 11 at both lateral sides of the gate electrode 13. Further, asource extension region 11 a and a drain extension region 11 b of p-typeare formed so as to partially overlap with the foregoing pocketinjection regions 11 p.

The foregoing p-type source and drain extension regions 11 a and 11 bextend up to the p-type SiGe mixed crystal regions 14A and 14Brespectively, wherein it should be noted that the p-type SiGe mixedcrystal regions 14A and 14B are formed in continuation with the p-typediffusion regions 11S and 11D respectively. It should be noted that thep-type diffusion regions 11S and 11D constitute respectively the sourceregion and the drain regions of the p-channel MOS transistor 10.

It should be noted that the p-type diffusion regions 11S and 11D areformed so as to include the SiGe mixed crystal regions 14A and 14Brespectively. As a result of such a construction, direct contact betweenthe p-type SiGe mixed crystal region 14A or 14B having a small bandgapand the n-type Si well that constitutes the device region 11A iseliminated, and occurrence of leakage current at the pn junction ofSi/SiGe interface is suppressed.

Further, with the construction of FIG. 3, Si epitaxial layers 15A and15B are formed on the SiGe mixed crystal regions 14A and 14Brespectively, and silicide layers 16A and 16B are formed on the surfaceof the Si epitaxial layers 15A and 15B. Further, a similar silicidelayer 16C is formed on the gate electrode 13.

With the p-channel MOS transistor 10 of the present embodiment, each ofthe SiGe mixed crystal regions 14A and 14B is defined by sidewallsurfaces 14 a, 14 b, 14 c and also a bottom surface 14 d as shown inFIG. 3, wherein it should be noted that each of the sidewall surfaces 14a, 14 b, 14 c and the bottom surface 14 d is formed of a flat facet.

In the illustrated example, the bottom surface 14 d is formed of a (001)surface parallel to the principal surface of the silicon substrate 11while the facet 14 b forms an angle θ2 generally perpendicular to thebottom surface 14 d. Further, the facet 14 c forms a smaller angle θ1than the foregoing angle θ2 with respect to the bottom surface 14 d.

Thus, it is the object of the present invention to provide a p-channeltransistor capable of providing a performance superior to that of theconventional p-channel MOS transistor that uses the SiGe mixed crystalregions as the compressive stressor, by optimizing the uniaxialcompressive stress field induced in the device region 11A incorrespondence to the channel region right underneath the gate electrode13 by constructing the bottom surface and the sidewall surface of theSiGe mixed crystal regions 14A and 14B by plural flat facets 14 a-14 d.

In the construction of FIG. 3, it should be noted that the mutuallyopposing sidewall surfaces of the SiGe mixed crystal regions 14A and 14Bthat define the channel region right underneath the gate insulation film12 are formed of the facet 14 b that extends perpendicularly to theprincipal surface of the silicon substrate 11. Thus, the distancebetween the mutually opposing SiGe mixed crystal regions 14A and 14Bdoes not increase in the downward direction of the silicon substrate 11from the interface between gate insulation film 12 and the siliconsubstrate 11, contrary to the conventional construction of FIG. 1 orFIG. 2, and it becomes possible to confine the uniaxial compressivestress to the channel region effectively.

Here, it should be noted that the facet 14 c is formed such that theSiGe mixed crystal regions 14A and 14B do not protrude to the n-typewell constituting the device region in the silicon substrate 11 from thep-type diffusion region that constitutes the source region 14S or thedrain region 14D.

On the other hand, in each of the SiGe mixed crystal regions 14A and14B, it should be noted that the sidewall surface defining the SiGemixed crystal region 14A or 14B changes the angle thereof to theprincipal surface of the silicon substrate 11 discontinuously from theangle θ2 to the angle θ1 at the part where the facet 14 b meets thefacet 14 c, while such a discontinuous change of the facet angle enablesconcentration of the compressive stress to the part of the device region11A located between the SiGe mixed crystal regions 14A and 14B.

FIGS. 4A-4F show various modifications of the p-channel semiconductordevice according to the first embodiment of the present invention. Inthe drawings, those parts corresponding to the parts explainedpreviously are designated by the same reference numerals and descriptionthereof will be omitted. It should be noted that FIGS. 4A-4F show thestate before formation of the silicide regions 16A-16C. In the drawings,and also in the drawings to be explained hereinafter, illustration ofthe pocket injection regions 11 p will be omitted.

Referring to FIG. 4A, the sidewall surfaces of the SiGe mixed crystalregions 14A and 14B are formed by the facet 14 b generally perpendicularto the principal surface of silicon substrate 11 and also by the bottomsurface 14 d parallel to the principal surface of the silicon substrate11, wherein the facet 14 b and the bottom surface 14 d form an angles ofsubstantially 90 degrees.

In the construction of FIG. 4A, the trenches 11TA and 11TB, in whichformation of the SiGe mixed crystal regions 14A and 14B is made, areformed by a dry etching process as shown in FIG. 5A, wherein thelocation of the bottom surface 14 d of the SiGe mixed crystal regions14A and 14B are set such that the corner part of the SiGe mixed crystalregions 14A and 14B, where the facet 14 b and the bottom surface 14 dintersect with each other, does not protrude into the region of then-type well from the foregoing source/drain regions 11S and 11D. Fillingof the trenches 11TA and 11TB with the SiGe mixed crystal regions 14Aand 14B will be described in detail later.

Contrary to this, the construction of FIG. 4B corresponds to theconstruction of FIG. 3 explained previously, in which the facet 14 b isformed perpendicularly to the silicon substrate 11 at first by formingthe trenches 11TA and 11TB by a dry etching process, as shown in FIG.5B, wherein the facet 14 c under the facet 14 b is formed subsequentlyby applying a thermal processing to the silicon substrate 11 at 550° C.in a hydrogen ambient after the foregoing dry etching process. Thereby,the facet 14 c is formed by the Si (111) surface that forms an angle of56 degrees with respect to the principal surface of the siliconsubstrate 11.

Because the corner where the facet 14 b and the bottom surface 14 d meetwith each other is truncated by the facet 14 c in the construction ofFIG. 4B, the risk that the corner part protrudes into the n-type wellbeyond the source region 11S or 11D is reduced even if the bottomsurfaces 14 d of the SiGe mixed crystal regions 14A and 14B are formedat a relatively deep level in the silicon substrate 11. Filling of thetrenches 11TA and 11TB with the SiGe mixed crystal regions 14A and 14Bwill be described in detail later.

The construction of FIG. 4C is formed by forming the trenches 11TA and11TB by applying a wet etching process to the silicon substrate 11 byusing an organic alkaline etchant (hydration tetramethyl ammonium: TMAH,choline, or the like) or hydration ammonium, or alternatively, byapplying a heat treatment of 800° C. in an ambient of hydrogen gas andHCl as shown in FIG. 5C. In this case, the facet 14 b perpendicular tothe silicon substrate 11 is not formed in the SiGe mixed crystal layerregions 14A and 14B, and instead, a facet 14 c of a Si (111) surfacestarts right away from the interface between the gate insulation film 12and the silicon substrate 11 with the angles of 56 degrees to theprincipal surface of the silicon substrate 11.

In the construction of FIG. 4D, formation of the trenches 11TA and 11TBin the silicon substrate 11 is started by a dry etching as shown in FIG.5D, followed by a wet etching process that uses TMAH or choline,hydration ammonium, or the like, as the etchant.

As a result of such a dry etching process, the facet 14 b is formed atfirst in the silicon substrate 11 perpendicularly to the principalsurface of the silicon substrate 11, while the facet 14 b is changed toa slope formed of the (111) surface by applying a wet etching process tothe facet 14 b by using TMAH. Further, there is formed another facet 14c formed of the (111) surface.

Thereby, it should be noted that the facet 14 b and the facet 14 c thusformed define together a space of wedge form as the foregoing trenches11TA and 11TB, such that the wedge formed trenches 11TA and 11TB invadein the silicon substrate 11 into the region right underneath thesidewall insulation films 13A and 13B toward the channel region. Here,it should be noted that the facet 14 c forms the angle of about 56degrees to the principal surface of the silicon substrate 11 incorrespondence to the Si (111) surface, while the facet 14 b forms theangle of about 146 degrees also in correspondence to the Si (111)surface.

According to the construction of FIG. 4D, the SiGe mixed crystal regions14A and 14B grown so as to fill the wedge-shaped trenches 11TA and 11TBhave respective tip ends invading to the region right underneath thesidewall insulation films 13A and 13B and coming close to the channelregion formed right underneath the gate insulation film 12. Thereby, astrong uniaxial compressive stress is applied to the channel region andmobility of the holes is improved significantly in the channel region.Thereby, because of the sharply pointed tip end part of the SiGe mixedcrystal regions 14A and 14B defined by intersection of two crystalsurfaces, there occurs concentration of stress at such a tip end part,and the effect of increasing the stress in the channel region isenhanced further.

The construction of FIG. 4E is the one based on the construction of FIG.4D and represents the case in which formation of the Si epitaxial layers15A and 15B on the SiGe mixed crystal regions 14A and 14B is omitted.

Further, the construction of FIG. 4F is also based on the constructionof FIG. 4D and represents the case in which a channel layer 11G of aSiGe mixed crystal is formed epitaxially on the silicon substrate 11 incorrespondence to the region right underneath the gate insulation film12. According to such a construction, the channel layer 11G itselfinduces the uniaxial compressive stress, and it becomes possible toimprove the mobility of the holes further in the channel layer 11G.

FIG. 6 is a diagram summarizing the formation process of trenches 11TAand 11TB shown in FIGS. 5A-5D in which the epitaxial growth of the SiGemixed crystal regions 14A and 14B is made.

Referring to FIG. 6, the silicon substrate 11 is a so-called (001)substrate having a (001) surface, and the trenches 11TA and 11TB haverespective sidewall surfaces each defined by a bottom surface 14 d andfacets 14 b and 14 c. Thereby, the facet 14 b forms the angle θ2 to theprincipal surface of silicon substrate 11, while the facet 14 c formsthe angle θ1 with respect to the principal surface of the siliconsubstrate 11. Thereby, the bottom surface 14 d is formed at the depth y1as measured from the interface between the gate insulation film 12 andthe silicon substrate 11, while the facet 14 b is formed down to thedepth y2. While it is preferable that the gate electrode 13 extends onthe surface of the silicon substrate 11 generally in the <110>direction, the gate electrode 13 may extend also generally in the <100>direction.

Especially, in the construction of FIG. 4A, it is preferable to set anyof the foregoing angles θ1 and θ2 to about 90 degree and the depth y1 to20-70 nm. It should be noted that such a depth y1 can be controlled withhigh precision by using a dry etching process.

In the construction of FIG. 4B, it is preferable to set the angle θ1 tothe range of 40-60 degrees and the angle θ2 up to about 90 degrees.Thereby, it is preferable to set the depth y1 to the range of 20-70 nmand the depth y2 to the range of 10-60 nm. These depths y1 and y2 can becontrolled with high precision by applying a dry etching process to thesilicon substrate 11.

Particularly, the angle θ1 takes the value of 56 degrees in the case thefacet 14 c is formed of the Si (111) surface as explained before withreference to FIG. 4B. However, it should be noted that the foregoingangle θ1 is by no means limited to the angles of 56 degrees. Thereby, itshould be noted that the angle θ2 can be controlled with high precisionby the heat treatment process conducted subsequently to the foregoingdry etching process at about 550° C. in the hydrogen ambient.

Furthermore, in the construction of FIG. 4C, the angles θ1 and θ2 takethe range of 50-60 degrees, and in the special case in which the facet14 c is formed of the Si (111) surface, the angles θ1 and θ2 take thevalue of 56 degrees. However, the angles θ1 and θ2 are by no meanslimited to the foregoing angle of 56 degrees. Also, while the depth y2becomes zero in the construction of FIG. 4C, it is preferable to set thedepth y1 to the range of 20-70 nm. It should be noted that such angleθ1, θ2 and the depth y1 can be controlled with high precision by using awet etching process applied to the silicon substrate 11 while using theorganic alkaline etchant such as TMAH, or alternatively, by a hightemperature gas phase etching process conducted in a HCl/hydrogenambient.

Further, in the construction of FIGS. 4D-4F, it is preferable to controlthe depth y1 to the range of 20-70 nm, the depth y2 to the range of10-60 nm, the angle θ1 to the range of 40-60 degrees and the angle θ2 tothe range of 90-150 degrees, by consecutively applying a dry etchingprocess and a wet etching process that uses the organic alkaline etchantsuch as TMAH, to the silicon substrate 11. Thereby, it should be notedthat it is possible with the present invention to control the angles θ1and θ2 and also the depths y1 and y2 precisely, by combining the dryetching process and the wet etching process at the time of formation ofthe trenches 11TA and 11TB. In this case, too, the angles θ1 and θ2 takethe value of 56 degrees and 146 degrees respectively in the case thefacets 14 b and 14 c are formed by the Si (111) surface. However, itshould be noted that the construction of FIGS. 4D-4F is not limited inthe case in which the facets 14 b and 14 c are formed by the Si (111)surface.

In any of the methods of FIGS. 5A-5D, it should be noted that the p-typesource region 11S and the p-type drain region 11D are formed in thesilicon substrate 11 at the outer sides of the sidewall insulation films13A and 13B, prior to the formation of the trenches 11TA and 11TB. Itshould be noted that the trenches 11TA and 11TB are formed inside suchp-type diffusion regions so as not to exceed the p/n junction interfacethereof.

In any of the methods of FIGS. 5A-5D, it is possible to form thetrenches 11TA and 11TB directly in the n-type Si well formed in thedevice region 11A of the silicon substrate 11 before formation of thesource/drain diffusion region 11S, 11D as shown in the example of FIG. 7and thereafter grow a p-type Si layer selectively on the surface of thetrenches 11TA and 11TB while supplying the Si gaseous source togetherwith a p-type dopant gas.

Second Embodiment

Hereinafter, the fabrication process of the p-channel MOS transistor ofFIG. 4D will be explained with reference to FIGS. 8A-8E.

Referring to FIG. 8A, the device region 11A is defined on the surface ofp-type silicon substrate 11 by the STI type device isolation structure11I, and an n-type well is formed in the device region 11A by injectingan n-type impurity element into the device region 11A.

Further, in the step of FIG. 8B, the gate insulation film 12 and thepolysilicon gate electrode 13 are formed on the silicon substrate 11 incorrespondence to the device region 11A as a result of patterning of anSiON film and a polysilicon film formed uniformly on the siliconsubstrate 11, and the p-type source extension region 11 a and the p-typedrain extension region 11 b are formed in the device region 11A byinjection of a p-type impurity element such as B+ while using thepolysilicon gate electrode 13 as a mask.

Further, after formation of the sidewall insulation films 13A and 13B onthe polysilicon gate electrode 13, the p-type impurity element such asB+ is injected once more, and as a result, the p-type source region 11Sand the p-type drain region 11D are formed in the device region 11A ofthe silicon substrate 11 at the outer sides of the sidewall insulationfilms 13A and 13B.

Next, in the step of FIG. 8C, a part of the device region of the siliconsubstrate 11 outside the sidewall insulation films 13A and 13B areetched first by a dry etching process with the depth of 10-60 nm.

As a result of such a dry etching process, there are formed trenches inthe silicon substrate 11 such that each trench is defined by verticalsidewall surfaces perpendicular to the principal surface of the siliconsubstrate 11 and a horizontal bottom surface, similarly to the case ofFIG. 5A explained previously. In the step of FIG. 8C, the verticalsidewall surface is etched further by a wet etching process that usesTMAH as the etchant, and with this, the trenches 11TA and 11TB areformed such that the facets 14 b and 14 c define the wedge-shapedsidewall surface of the trenches 11TA and 11TB. In the state of FIG. 8C,it should be noted that the tip end part of the foregoing wedge isformed close to the channel region located right under gate electrode 13by invading inward of the outer edges of the sidewall insulation films13A and 13B.

Further, in the step of FIG. 8D, the structure of FIG. 8C is introducedinto a low-pressure CVD apparatus filled with an inert gas such ashydrogen gas, nitrogen gas, Ar gas, He gas, or the like, and held to thepressure of 5-1330 Pa, after a removal process of native oxide film, andheld for 5 minutes in the maximum at the foregoing pressure of 5-1330 Pa(H₂-Bake) after heating to the temperature of 400-550° C. in a hydrogenambient (Heat-UP).

Further, while holding the partial pressure of the inert gas ambientsuch as hydrogen, nitrogen, He or Ar to 5-1330 Pa at the substratetemperature of 400-550° C., a silane (SiH₄) gas, a germane (GeH₄) gasand a diborane (B₂H₆) gas are supplied over the duration of 1-40 minutesrespectively as the gaseous source of Si, the gaseous source of Ge andthe dopant gas, with respective partial pressures of 1-10 Pa, 0.1-10 Paand 1×10⁻⁵-1×10⁻³ Pa, in addition to a hydrogen chloride (HCl) gassupplied as an etching gas with the partial pressure of 1-10 Pa. Withthis, the p-type SiGe mixed crystal regions 14A and 14B are grownepitaxially in the trenches 11TA and 11TB respectively (SiGe-Depo).

With such an epitaxial growth of the SiGe mixed crystal layers 14A and14B, it should be noted that the crystal quality of the SiGe mixedcrystal layers 14A and 14B is improved particularly when the (100)surface or (111) surface of Si is exposed at the bottom surface orsidewall surface of the trenches 11TA and 11TB. From this viewpoint,too, the construction having the sidewall surface of the wedge formdefined by the facets 14 b and 14 c forming the Si (111) surfaces shownin FIG. 8C, is thought advantageous for the trenches 11TA and 11TB.

In the process of FIG. 8D, the SiGe mixed crystal layers 14A and 14Bfilling the trenches 11TA and 11TB induce the uniaxial compressivestress originating from the lattice constant difference with respect tothe silicon substrate 11 in the channel region right underneath the gateinsulation film 12 in the foregoing device region 11A. Because the tipend parts of the wedges invade to the regions located right underneaththe sidewall insulation films 13A and 13B in the silicon substrate 11, alarge compressive stress is applied to the channel region rightunderneath the gate insulation film 12.

Further, in the step of FIG. 8D, a p-type semiconductor layer primarilyformed of Si is formed on the SiGe mixed crystal layers 14A and 14B to athickness Ys of 0-20 nm, by supplying the silane gas and the diboranegas with respective partial pressures of 1-10 Pa and 1×10⁻⁴-1×10⁻² Pa,together with the hydrogen chloride (HCl) gas of the partial pressure of1-10 Pa, at the temperature equal to or lower than the temperature usedfor forming the SiGe mixed crystal layers 14A and 14B. With this, thecap layers 15A and 15B are respectively formed on the SiGe mixed crystalregions 14A and 14B (CapSi-Depo). Here, it should be noted that the casein which the thickness Ys is set to 0 nm means that there occurs noformation of the cap layers 15A and 15B.

It should be noted that the foregoing cap layers 15A and 15B areprovided in anticipation of the silicide formation process of FIG. 8E,and thus, it is preferable to use a p-type silicon layer, on whichsilicide formation is made easily, while it is possible that the caplayers 15A and 15B contain Ge with the atomic concentration if 0-20%.Further, it is possible to use a SiGeC mixed crystal layer containingabout 2% of C (carbon) in terms of atomic concentration for the caplayers 15A and 15B. In the case Ge is to be incorporated into the caplayers 15A and 15B, a GeH₄ gas may be added to the gaseous source in thegrowth process of the cap layers with a partial pressure of 0-0.4 Pa.

In the case the material constituting the sidewall insulation films 13Aand 13B contains Si with relatively large amount, the selectivity ofgrowth of the SiGe mixed crystal layer tends to become deteriorated, andthere may be caused a growth of SiGe nuclei on such sidewall insulationfilms 13A and 13B in the case the growth of SiGe mixed crystal regionshave been conducted according to the foregoing process.

In such a case, the structure of FIG. 8D is exposed to a hydrogenchloride (HCl) gas for short time period at the same temperature usedfor growing the SiGe mixed crystal regions 14A and 14B or lower, suchthat the part of the sidewall insulation films 13A and 13B or the deviceisolation structure 11I that may become the nuclei of silicide growth isremoved by etching (PostEtch).

The structure thus obtained is then cooled to the temperature below 400°C. in an inert ambient (CoolDown) and taken out from the low pressureCVD apparatus.

It should be noted that this PostEtch process can be conducted forexample in an inert or reducing ambient of hydrogen, nitrogen, He, orthe like, under the process pressure of 5-1000 Pa while supplying thehydrogen chloride gas with the partial pressure of 10-500 Pa over theduration of typically 0-60 minutes.

Further, the substrate of FIG. 8D thus taken out is introduced to asputtering apparatus in the process of FIG. 8E and silicide films 16Aand 16B of nickel silicide or cobalt silicide are formed on the caplayers 15A and 15B respectively, by a salicide process. In the step ofFIG. 8E, a silicide film 16C is formed also on the polysilicon gateelectrode 13 simultaneously.

Thus, with the process of FIG. 8D, in which the SiGe mixed crystal layeris formed by a low temperature process at the temperature of 550° C. orlower, there occurs no substantial change of distribution profile of theimpurity element in any of the pocket injection regions not illustratedor the source/drain extension regions 11 a and 11 b, or further in thesource/drain regions 11S and 11D, even when formation of the SiGe mixedcrystal regions 14A and 14B is conducted after the formation of thesource/drain regions 11S and 11D. Thereby, desired operationalcharacteristics are secured.

Meanwhile, in the step of FIG. 8D, it should be noted that, while theSiGe mixed crystal layers 14A and 14B have the thickness Y2 of 20-70 nmcorresponding to the depth of the trenches 11TA and 11TB in the partlocated under the interface between the gate insulation film 12 and thesilicon substrate 11, the epitaxial growth of the SiGe mixed crystallayers 14A and 14B is continued to the height Y1 of 0-30 nm beyond theforegoing interface. Here, it should be noted that, in the case theheight Y1 is 0 nm, this means that the SiGe mixed crystal layers 14A and14B are not grown beyond the interface between the gate insulation film12 and the silicon substrate 11.

By growing the SiGe mixed crystal regions 14A and 14B beyond theinterface between the gate insulation film 12 and the silicon substrate11 in the process of FIG. 8D, it becomes possible to form the silicidelayers 16A and 16B, which tend to accumulate a tensile stress therein,with large separation from the channel region, in which existence ofcompressive stress is desired. Thereby, it becomes possible to suppressthe effect of canceling the uniaxial compressive stress, induced in thechannel region by the SiGe mixed crystal regions 14A and 14B, by thetensile stress of the silicide films 16A and 16B. Thereby, it ispreferable to control the salicide process for forming the silicidelayers 16A and 16B such that the silicide layers 16A and 16B do not toreach the SiGe mixed crystal regions 14A and 14B across the cap layers15A and 15B.

It should be noted in FIG. 9 that the part of the SiGe mixed crystalregions 14A and 14B grown beyond the interface of the gate insulationfilm 12 and the silicon substrate 11 has a side surface defined by thefacet 14 a at the side facing the channel region, while the side facingthe device isolation structure 11I is defined by the facet 14 e.Thereby, it is preferable that the facet 14 a forms an angle θ3 of 40-90degree and the facet 14 b forms an angle θ4 of 40-60 degree.

Particularly, by setting the angle θ3 to 90 degrees or less, thesilicide layers 16A and 16B on the cap layers 15A and 15B are not formedin contact with the sidewall insulation film 13A or 13B of the gateelectrode 13, and it becomes possible to suppress the problems ofoccurrence short circuit through the silicide layers 16A and 16B orformation of parasitic capacitance between and gate electrode 13 and thesilicide layer 16A or 16B.

Next, the relationship between the Ge concentration in the SiGe mixedcrystal regions 14A and 14B formed with the process of FIG. 8D and thethicknesses Y1 and Y2 will be examined.

Generally, it is known that, when epitaxial growth is conducted in astrained system with the thickness exceeding a critical thickness,defects such as dislocations are induced in the epitaxial structure, andsemiconductor layer of the quality suitable for use as the active regionof a semiconductor device is not obtained.

On the other hand, as a result of the experimental investigations thatconstitute the foundation of the present invention, it was discoveredthat, in the case a SiGe mixed crystal layer is formed on the deviceregion 11A of the semiconductor device with a limited area, there arecases in which the quality of the semiconductor layer thus grown andforming a strained system is not deteriorated even if the thickness ofthe semiconductor layer is increased beyond the so-called criticalthickness, contrary to the model in which epitaxial growth is madecontinuously on a two-dimensional surface, and that there are also casesin which the quality of the semiconductor layer is not deteriorated evenwhen the Ge concentration is increased beyond the critical concentrationlevel, beyond which it has been thought that there would occur formationof defects such as dislocations. Further, it should be noted that this“effective” critical thickness increases with decreasing growthtemperature, and thus, it becomes possible to induce the distortion inthe channel region of the MOS transistor more effectively, by using theSiGe mixed crystal grown selectively in a localized area at a lowtemperature.

For example, it was confirmed that there occurs no degradation ofcrystal quality in the SiGe mixed crystal regions 14A and 14B when aSiGe film having the thickness Y1 of 20 nm and the thickness Y2 of 60 nmas defined in FIG. 9 has been used for the SiGe mixed crystal regions14A and 14B, even when the Ge concentration level is increased up to theconcentration level of 24% beyond the conventionally accepted limitingconcentration level of 20%. In this experiment, it should be noted thatthe cap layers 15A and 15B of p-type Si have been grown epitaxially onthe SiGe mixed crystal regions 14A and 14B with the thickness of 10 nm.

Further, it was confirmed that the epitaxial growth of the SiGe mixedcrystal layers 14A and 14B is possible up to the atomic concentrationlevel of Ge of about 40%.

Further, it was discovered that, in such a SiGe mixed crystal layer ofhigh Ge concentration, there occurs increase in a solubility limit of Bintroduced as a p-type dopant and that it is possible to use a dopantconcentration level of about 1×10²² cm⁻³. In the above experiment, thedopant concentration in the SiGe mixed crystal regions 14A and 14B isset to the range of 1×10¹⁸-1×10²¹ cm⁻³. On the other hand, the dopantconcentration of B is set to about 1×10¹⁸-1×10²⁰ cm⁻³ in the cap layers15A and 15B characterized by low Ge concentration level.

Thus, with the present invention, it becomes possible to apply a largeruniaxial compressive stress to the channel region of the p-channel MOStransistor by increasing the Ge concentration in the SiGe mixed crystalregions 14A and 14B that act as the compression stressor.

Third Embodiment

FIG. 10A is a diagram summarizing the process of FIG. 8D conducted in alow-pressure CVD apparatus explained above as a third embodiment thepresent invention.

Referring to FIG. 10A, a substrate to be processed is introduced intothe low-pressure CVD apparatus at the temperature of 400° C. or lower atfirst, and the temperature is raised to a predetermined processtemperature of 400-550° C. in a hydrogen ambient (HeatUp).

Thereafter, the substrate to be processed is held at the same processtemperature in the same hydrogen ambient for the duration of 5 minutesin the maximum, and a hydrogen heat treatment process is conducted(H₂-Bake).

Subsequently, the processing gas introduced to the low-pressure CVDapparatus is changed at the same process temperature, and the epitaxialgrowth of the p-type SiGe mixed crystal regions 14A and 14B is conductedin the trenches 11TA and 11TB as explained previously (SiGe Depo).

Further, in the step of FIG. 10A, the composition or partial pressure ofthe processing gas introduced into the low-pressure CVD apparatus ischanged subsequently to the epitaxial growth of the p-type SiGe mixedcrystal regions 14A and 14B while maintaining the same processtemperature of 400-550° C., and the cap layers 15A and 15B of p-type Sior p-type SiGe(C) mixed crystal are grown epitaxially on the SiGe mixedcrystal regions 14A and 14B (Cap Si Depo).

Further, in the step of FIG. 10A, a hydrogen chloride gas is introduced,after formation of the cap layers 15A and 15B, into the low-pressure CVDapparatus in the inert or hydrogen ambient at the process temperature of400-550° C. Thereby, any structure that can become the nuclei ofsilicide formation in the silicide formation process of FIG. 8E isremoved from the sidewall insulation film 13A, 13B or the deviceisolation structure 11I (Post Etch), and the substrate temperature issubsequently lowered to 400° C. or lower (Cool Down) in the hydrogen orinert gas ambient.

Thus, with the process of FIG. 10A, it becomes possible to conduct theprocess steps from Heat Up to Cool Down efficiently and continuously inthe low-pressure CVD apparatus without contamination, by eliminating thestep of taking out the substrate to the atmosphere in the midway of theprocessing. Also, by conducting the processes from the H₂-Bake processto Post Etch process at the same substrate temperature, the processsteps of changing the substrate temperature up and down is eliminated,and the overall process throughput is improved significantly.

FIG. 10B shows the process corresponding to the embodiment explainedpreviously with reference to FIG. 9 in which the source region 11S andthe drain region 11D are formed growing a p-type Si layer epitaxiallyafter formation of the trenches 11TA and 11TB so as to cover thesidewall surface thereof.

Referring to FIG. 10B, the source region 11S and the drain region 11Dcan be formed in this case by introducing the silane gas and thediborane gas and the HCl gas into the low-pressure CVD apparatus withrespective partial pressures of 1-10 Pa, 1×10⁻⁴-1×10⁻² Pa and 1-10 Pa,for example, after the foregoing H₂-Baking process, at the specifiedprocess temperature of 400-550° C.

Further, as shown in FIG. 10C, it is possible to omit the Post Etchprocess in the process of FIG. 10A according to the needs.

Fourth Embodiment

FIG. 11 is a diagram showing the construction of the low-pressure CVDapparatus 40 used for the process of FIG. 8D or the process of FIGS.10A-10C explained before.

Referring to FIG. 11, the low-pressure CVD apparatus 40 is a so-calledcluster type substrate processing apparatus in which the CVD reactionfurnace 41 for conducting the process steps of FIGS. 10A-10C areconnected to a preprocessing chamber 43 via a substrate transportationchamber 42 filled with an inert gas such as a nitrogen gas, and thesubstrate W having the structure corresponding to the state of FIG. 10Cis introduced into the substrate transportation chamber 42 via a gatevalve not illustrated, wherein the substrate thus introduced istransported from the substrate transportation chamber 42 to thepreprocessing chamber 43.

In the preprocessing chamber 43, a pre-processing for removing thenative oxide film from the substrate surface is conducted by conductinga processing in a diluted hydrofluoric acid (DHF) and subsequent waterrinse processing, or by a hydrogen radical cleaning processing, oralternatively by an HF gas phase processing.

The substrate finished with the pre-processing process is transported tothe CVD reaction furnace 41 through the substrate transportation chamber42 without being exposed to the air and the process steps of FIGS.10A-10C are conducted.

Fifth Embodiment

In the p-channel MOS transistor explained previously, a thermal oxidefilm or an SiON film having a larger specific dielectric constant than athermal oxide film is used frequently for the gate insulation film 12.

At the time of formation of such a gate oxide film 12, it is generallypracticed to apply a heat treatment process to the surface of thesilicon substrate 11 in a hydrogen ambient prior to the formation of thegate oxide film 12 for removing the native oxide film therefrom.

It should be noted that such a heat treatment process in the hydrogenambient is carried out prior to the formation of the trenches 11TA and11TB in the silicon substrate 11, in the state in which only the deviceisolation structure 11I is formed on the silicon substrate 11. Thereby,as a result that the native oxide film is removed completely from thesurface of silicon substrate 11 with such a processing, pinning of theSi atoms on the substrate surface is eliminated, and it becomes possiblefor the Si atoms to migrate freely over the silicon substrate 11outwardly in device region 11A defined by the device isolation structure11I.

As a result of the free migration of the Si atoms over the surface ofthe silicon substrate 11, it should be noted that there is formed anundulation in the device region 11A as shown in FIGS. 12A-12C. Here, itshould be noted that FIG. 12A is a plan view showing the part of thesilicon substrate 11 including the device isolation region 11I and thedevice region 11A, while FIG. 12B is a cross-sectional view of FIG. 12Ataken in the gate width direction. Further, FIG. 12C shows the structureof FIG. 12B in the state in which the trenches 11TA and 11TB are formedin the device region 11A and the trenches 11TA and 11TB thus formed arefilled with the p-type SiGe mixed crystal regions 14A and 14B.

Referring to FIG. 12B, there is formed conspicuous undulation on thesurface of the silicon substrate 11 in the device region 11A in the casethe device region 11A has a relatively large gate width GW, wherein thisundulation on the silicon substrate surface is transferred to the bottompart of the trenches 11TA and 11TB in the case the trenches 11TA and11TB are formed as shown in FIG. 12C.

On the other hand, in the trenches 11TA and 11TB are filled with theSiGe mixed crystal regions 14A and 14B, there appears a flat surface atthe top surface of the SiGe mixed crystal regions 14A and 14B due to theself limiting effect of the time of the crystal growth process.

Thus, in such a case, the SiGe mixed crystal regions are formed on theundulating bottom surface with a flat top surface. Thereby, increase anddecrease of volume of the SiGe mixed crystal caused by undulation of thebottom surface is cancelled out at the level shown in FIG. 12C by thedotted line, and compressive stress similar to the one obtained for thecase in which the SiGe mixed crystal regions are formed on a flatsurface is obtained in the channel region.

On the other hand, in the case the gate width GW is small, there appearsonly a convex surface on the surface of the device region 11A as itshown in FIGS. 13A and 13B, and thus, the effective volume of the SiGemixed crystal regions 14A and 14B is decreased by the effect of theconvex surface at the bottom surface in the case the trenches 11TA and11TB are formed on the silicon substrate surface having such a convexsurface and the trenches are filled with the SiGe mixed crystal regions14A and 14B, in view of the flat surface of the SiGe mixed crystalregions 14A and 14B appearing as a result of the self-limiting effect.Thereby, the compression stress induced in the channel region isdecreased substantially.

Thus, the present embodiment carries out the removal process of thenative oxide, conducted immediately before formation of the gateinsulation film 12 for removing the native oxide film from the siliconsubstrate surface, in an ambient not containing hydrogen, such as theambient of nitrogen, Ar or He, for example, at the temperature that doesnot exceed 900° C.

As a result of the native oxide removal process thus conducted at lowtemperature not containing hydrogen, formation of the convex surface atthe bottom surface of the trenches 11A and 11B is suppressed as shown inFIG. 13C, and decrease of effective volume of the SiGe mixed crystalregions 14A and 14B filling the trenches 11A and 11B is avoided. Thus,it becomes possible to induce a large uniaxial compressive stress in thechannel region with the construction of the present embodiment.

Sixth Embodiment

Meanwhile, in the process of FIG. 8D, there is inevitably caused adeposition of SiGe mixed crystal on the surface of the polysilicon gateelectrode 13 at the time of filling the trenches 11TA and 11TB by theSiGe mixed crystal regions 14A and 14B, when the surface of thepolysilicon gate electrode 13 is exposed.

Thus, with the process of FIG. 8D, a mask M is formed on a polysiliconfilm 13M used for forming the polysilicon gate electrode 13 incorrespondence to the polysilicon gate electrode 13 at the time offorming the polysilicon gate electrode 13, by using a silicon oxide filmor silicon nitride film as shown in FIG. 14A.

Next, in the step of FIG. 14B, the structure of FIG. 14A is exposed to ahydrogen/diborane gas mixture ambient at the temperature of 300-550° C.,to form a B (boron) film 13Bo on the polysilicon film 13M incorrespondence to the region where the gate electrode 13 is formed withthe thickness of 1-10 nm.

Next, in the process of FIG. 14C, the polysilicon film 13M is patteredto form the gate electrode 13 and the sidewall insulation films 13A and13B are formed. In FIG. 14C, it should be noted that representation ofthe CVD oxide film 12I is omitted. In the structure of FIG. 14C, itshould be toned that the boron mask pattern 13Bo is formed on the toppart of the polysilicon gate electrode 13.

Because there occurs no growth of the SiGe layer on such a boron maskpattern 13Bo, there occurs no growth of the SiGe mixed crystal layer onthe polysilicon gate electrode 13 even when the SiGe mixed crystalregions 14A and 14B are grown in the trenches 11TA and 11TB in the stepof FIG. 8D.

Further, it is also possible to dope the part of the polysilicon film13M forming the polysilicon gate electrode 13 selectively to p-type inthe step of FIG. 14B.

Further, the present invention is not limited to the embodimentsdescribed heretofore, but various variations and modifications may bemade without departing from the scope of the invention.

1. A semiconductor device comprising: a silicon substrate; a gateinsulating film over the silicon substrate; a gate electrode formed overthe gate insulating film; a source region and a drain region formed inthe silicon substrate; a first SiGe mixed crystal region formed in thesource region; a second SiGe mixed crystal region formed in the drainregion; a first silicide layer over the first SiGe mixed crystal region;and a second silicide layer over the second SiGe mixed crystal region,wherein a bottom of the first silicide layer and a bottom of the secondsilicide layer are located higher than a first boundary between thesilicon substrate and the gate insulating film.
 2. The semiconductordevice according to claim 1, further comprising: a third SiGe mixedcrystal region between the first silicide layer and the first SiGe mixedcrystal region; and a fourth SiGe mixed crystal region between thesecond silicide layer and the second SiGe mixed crystal region, whereina Ge concentration of the third SiGe mixed crystal region is less than aGe concentration of the first SiGe mixed crystal region, and a Geconcentration of the fourth SiGe mixed crystal region is less than a Geconcentration of the second SiGe mixed crystal region.
 3. Thesemiconductor device according to claim 2, wherein both the Geconcentration of the third SiGe mixed crystal region and the Geconcentration of the fourth SiGe mixed crystal region are 0 atom % to 20atom %.
 4. The semiconductor device according to claim 1, wherein thefirst SiGe mixed crystal region and the second SiGe mixed crystal regionare crystal layers formed by epitaxial growth.
 5. The semiconductordevice according to claim 1, further comprising: a sidewall insulatingfilm formed on side wall of the gate electrode.
 6. The semiconductordevice according to claim 5, wherein a second boundary between the firstSiGe mixed crystal region and the silicon substrate includes at leastone facet, and a third boundary between the second SiGe mixed crystalregion and the silicon substrate includes at least one facet.
 7. Thesemiconductor device according to claim 6, wherein the second boundaryincludes two facets, and a cross-sectional shape of the second boundaryincludes a first convex portion, and wherein the third boundary includestwo facets, and a cross-sectional shape of the third boundary includes asecond convex portion.
 8. The semiconductor device according to claim 7,wherein one of the two facets included in the second boundary isperpendicular to the first boundary; and wherein one of the two facetsincluded in the third boundary is perpendicular to the first boundary.9. The semiconductor device according to claim 7, wherein a peak of thefirst convex portion is located under the sidewall insulating film, andwherein a peak of the second convex portion is located under thesidewall insulating film.
 10. The semiconductor device according toclaim 7, wherein the two facets included in the second boundary areformed substantially of a (111) surface or a crystallographicallyequivalent surface thereof; wherein the two facets included in the thirdboundary are formed substantially of a (111) surface or acrystallographically equivalent surface thereof, and wherein a surfaceof the silicon substrate is formed of a (100) surface.
 11. Thesemiconductor device according to claim 1, wherein a second boundarybetween the first SiGe mixed crystal region and the silicon substrateincludes a facet perpendicular to the first boundary; and wherein athird boundary between the second SiGe mixed crystal region and thesilicon substrate includes a facet being perpendicular to the firstboundary.
 12. The semiconductor device according to claim 11, whereinthe facet included in the second boundary is formed substantially of a(111) surface or a crystallographically equivalent surface thereof;wherein the facet included in the third boundary is formed substantiallyof a (111) surface or a crystallographically equivalent surface thereof;and wherein a surface of the silicon substrate is formed of a (100)surface.
 13. The semiconductor device according to claim 11 wherein asecond boundary between the first SiGe mixed crystal region and thesilicon substrate includes a facet being not perpendicular to a thefirst boundary; and wherein a third boundary between the second SiGemixed crystal region and the silicon substrate includes a facet beingnot perpendicular to the first boundary.
 14. The semiconductor deviceaccording to claim 13, wherein the facet included in the second boundaryis formed substantially of a (111) surface or a crystallographicallyequivalent surface thereof; wherein the facet included in the thirdboundary is formed substantially of a (111) surface or acrystallographically equivalent surface thereof; and wherein a surfaceof the silicon substrate is formed of a (100) surface.